NCAB PRODUCTION PROCESS
3. Lamination – Bonding Layers Together
Our inner layers are complete – time for lamination! Lamination is the process of pressing the inner layers together under heat and pressure to turn them into one strong PCB. Here, it’s important we have perfect alignment, perfect chemical control, and perfect temperature and pressure control.
This process includes adding an Oxide layer, stacking and aligning the cores (called Lay-Up), and Bonding – or “glueing” the layers together.
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